1. KYOCERA sintered conductive silver adhesive CT2700 is a high temperature conductivity and high conductivity high temperature resistant adhesive material.
2, in addition to metal, it can also join electronic parts on glass and ceramic non-metal substrate.
3, without pressure, the substrate and fittings can be joined.
4. Generally speaking, the sintered silver glue using metal nanoparticles must exert pressure when it is used to bond substrates with electronic parts. The bonding temperature is very low, 200 C, and the general sintered silver glue is 250 ~ 300 C. Because of resin dispersion, it is not easy to produce metal fatigue and high reliability similar to solder. The thermal conductivity is more than two times that of soldering tin.
5. The resin is sintered through silver to form sintering network, so as to achieve high bonding strength and high heat conductivity, 200W/mK, through the unique resin dispersion system, to achieve high heat resistance (high temperature) 250 degrees.
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